Next-generation power generation devices, electronics, and telecommunications often require microfabricated ceramics with very high tolerances and reliability.

Ceramatec, Inc. is developing advanced materials and microfabricated structures for varied applications such as high data-density fiber optic interconnects, hydrogen generation ceramic microreactors, high-temperature heat exchangers, and heat-pipes for microelectronics.

Ceramatec has produced many proprietary materials for device fabrication such as castable nanoceramics, advanced high-toughness silicon carbide, and polymer derived ceramics. We are also capable in advanced ceramic fabrication techniques such as tape casting, lamination, screen-printing and co-sintering .

Castable Ceramics

Technical Advantages

  • CERCANAM©: CERamatec CAstable NAno- Materials
  • Feasibility for microfabrication with sub-micron dimensional tolerance
  • Simple, one-step processing even for complex 3D geometries that would require multiple-step processing with other technologies/materials.
  • Significantly lower processing costs and production times for complex geometries.
  • Scalability to large volume production with very high component production rates.
  • Excellent thermal cycling, thermal shock properties
  • Continuous use temperature stability up to 1000oC in air
  • Component surface areas can be tailored to be over 100 m2/g
  • High surface are allows catalyst deposition with no washcoat.
  • Flexural strengths as high as 80 MPa.

    
Silicon Wafer   CERCANAM Pyramid
 

Applications:

  • Alternative to silicon for high-T MEMS devices and microreactors
  • Micromachined sensors, substrates for optical switches, fiber-optic connectors, custom microreactors.
  • High-Surface Area (HSA) CERCANAM

    
SEM of Copper Penny   CERCANAM© Penny Imprint
 
HSA CERCANAM© component Net-worked sub-micron and nano-porosity
 
Castable Ceramics

    
High-Temperature Heat Exchanger   Ceramic, Micro-channel Heat Pipes

 
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